DocumentCode :
2213833
Title :
Characterisation, Modelling and Design of Bond-Wire Interconnects for Chip-Package Co-Design
Author :
Chandrasekhar, Arun ; Stoukatch, Serguei ; Brebels, Steven ; Balachandran, Jayaprakash ; Beyne, Eric ; De Raedt, Walter ; Nauwelaers, Bart ; Poddar, Anindya
Author_Institution :
MCP-MaRS, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium. Phone: +32 16 288228, E-mail: achandra@imec.be
fYear :
2003
fDate :
Oct. 2003
Firstpage :
301
Lastpage :
304
Abstract :
This work is a comprehensive experimental investigation of chip to package wirebond interconnects for chip-package co-design. Wirebonds are interconnect bottlenecks in RF design, but are difficult to avoid due to their low cost and manufacturing ease. We have shown measurements on wirebonds in coplanar configuration with different return paths and also the cross coupling. We have also extracted lumped and distributed models and demonstrate the excellent agreement with measurements atleast upto 15GHz. We have proposed multi-wirebonds as a potential solution for better impedance matching. Different types of inductors with Q-factors of upto 100 have also been illustrated. We show influence of encapsulant on wirebonds and finally we also demonstrate a methodology to extract the time-domain response from S-parameters.
Keywords :
Bonding; Costs; Impedance matching; Inductors; Manufacturing; Packaging; Q factor; Radio frequency; Semiconductor device measurement; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2003 33rd European
Conference_Location :
Munich, Germany
Print_ISBN :
1-58053-834-7
Type :
conf
DOI :
10.1109/EUMA.2003.340950
Filename :
4143014
Link To Document :
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