DocumentCode :
2213957
Title :
Wafer Level Reliability Testing Physics and Modelling
Author :
Tyree, Vance C. ; Pierce, Donald G.
Author_Institution :
USC/Information Sciences
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
187
Lastpage :
187
Keywords :
Circuit testing; Electromigration; Equations; Extrapolation; Failure analysis; Life estimation; Materials testing; Physics; Semiconductor device modeling; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666307
Filename :
666307
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2213957
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