• DocumentCode
    2214192
  • Title

    SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration

  • Author

    Takemura, Koichi ; Kikuchi, Katsuya ; Ueda, Chihiro ; Baba, Kazuhiro ; Aoyagi, Masahiro ; Otsuka, Kanji

  • Author_Institution
    Assoc. of Super-Adv. Electron. Technol. (ASET), Sagamihara, Japan
  • fYear
    2009
  • fDate
    28-30 Sept. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Simultaneous switching noise (SSN) suppression is a serious problem when operating 3D large-scale integrated circuits (3D LSIs). Thin film capacitors directly connected to LSIs using 3D integration technology are expected to reduce impedance for a power distribution network (PDN). We fabricated various multi-terminal 10 times 10 mm SrTiO3 thin film capacitors with the capacitance values larger than 1 muF, and explored the impedance in a high frequency region. The equivalent series resistance (ESR) and equivalent series inductance (ESL) values for the metal-insulator-metal (MIM) capacitors are affected by the number of contacts. Typically, the ESR values are less than 1 mOmega and the ESL values are estimated to be a few pH. The SrTiO3 MIM capacitors on Si interposers are suitable for reducing both self- and transfer-impedance of a PDN for 3D-LSIs.
  • Keywords
    MIS capacitors; capacitance; distribution networks; electric resistance; inductance; large scale integration; silicon; strontium compounds; thin film capacitors; 3D LSI; 3D large-scale integrated circuit; 3D system integration; Si; SrTiO3; capacitance value; equivalent series inductance; equivalent series resistance; interposer; metal-insulator-metal capacitor; power distribution network; simultaneous switching noise suppression; thin film decoupling capacitor; Impedance; Integrated circuit noise; Integrated circuit technology; Large scale integration; MIM capacitors; Paramagnetic resonance; Power systems; Switched capacitor networks; Switching circuits; Thin film circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-4511-0
  • Electronic_ISBN
    978-1-4244-4512-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2009.5306572
  • Filename
    5306572