DocumentCode :
2214462
Title :
Building-In Reliability: Development Through Manufacturing
Author :
Marcoux, P.J.
Author_Institution :
Hewlett Packard Company
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
189
Lastpage :
195
Keywords :
Cause effect analysis; Costs; Degradation; Electrostatic discharge; Integrated circuit reliability; MOSFET circuits; Manufacturing processes; Packaging; Semiconductor device manufacture; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666309
Filename :
666309
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2214462
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