Title :
A tileable switch module architecture for homogeneous 3D FPGAs
Author :
Razavi, Seyyed Ahmad ; Zamani, Morteza Saheb ; Bazargan, Kia
Author_Institution :
Amirkabir Univ. of Technol., Tehran, Iran
Abstract :
3D technology is an attractive solution for reducing wirelength in a field programmable gate array (FPGA). However, trough silicon vias (TSV) are limited in number. In this paper, we propose a tilable switch module architecture based on the 3D disjoint switch module for 3D FPGAs. Experimental results over 20 MCNC benchmarks show 62% reduction in the number of TSVs on average and small improvements in horizontal channel width and delay compared to the original 3D disjoint SM.
Keywords :
field programmable gate arrays; 3D disjoint switch module; 3D technology; channel width; field programmable gate array; homogeneous 3D FPGA; through silicon vias; tileable switch module architecture; Delay; Field programmable gate arrays; Integrated circuit interconnections; Logic devices; Routing; Samarium; Silicon; Switches; Through-silicon vias; Topology;
Conference_Titel :
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-4511-0
Electronic_ISBN :
978-1-4244-4512-7
DOI :
10.1109/3DIC.2009.5306586
