DocumentCode :
2214726
Title :
Materials characterization using a structure based on microstrip line
Author :
Zarral, Lamia ; Ndagijimana, J.
Author_Institution :
Dept. of Electron., FERHAT Abbess Univ., Setif, Algeria
fYear :
2011
fDate :
8-10 Sept. 2011
Firstpage :
279
Lastpage :
281
Abstract :
The considerable evolution of microelectronics has highlighted the need for new dielectric materials of high permittivity (high-k). Because of their high permittivity, these materials can also be very good candidates for other microwave applications, especially if their dielectric losses are low. A new application of miniature antennas performed on these high-k materials and designed a new concept of interconnections without son. Proper use of these materials requires a knowledge of their dielectric properties. To do so, a rigorous characterization of these materials has been established, and we used to characterize our materials. We present in this section a technique for extracting the permittivity and permeability of high-k materials from measurements of planar transmission lines.
Keywords :
dielectric losses; high-k dielectric thin films; microstrip lines; permeability; permittivity; dielectric losses; dielectric materials; dielectric properties; high permittivity; high-k materials; material characterization; microelectronics; microstrip line; permeability; planar transmission line measurement; Dielectric measurements; Dielectrics; High K dielectric materials; Microelectronics; Permittivity; Transmission line measurements; Electric characterization; coaxial probe; complex permittivity; multilayer materials; semiconductor materials; thin layer dielectric; transmission-line;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mediterranean Microwave Symposium (MMS), 2011 11th
Conference_Location :
Hammamet
ISSN :
2157-9822
Print_ISBN :
978-1-4577-1814-4
Electronic_ISBN :
2157-9822
Type :
conf
DOI :
10.1109/MMS.2011.6068580
Filename :
6068580
Link To Document :
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