• DocumentCode
    2214726
  • Title

    Materials characterization using a structure based on microstrip line

  • Author

    Zarral, Lamia ; Ndagijimana, J.

  • Author_Institution
    Dept. of Electron., FERHAT Abbess Univ., Setif, Algeria
  • fYear
    2011
  • fDate
    8-10 Sept. 2011
  • Firstpage
    279
  • Lastpage
    281
  • Abstract
    The considerable evolution of microelectronics has highlighted the need for new dielectric materials of high permittivity (high-k). Because of their high permittivity, these materials can also be very good candidates for other microwave applications, especially if their dielectric losses are low. A new application of miniature antennas performed on these high-k materials and designed a new concept of interconnections without son. Proper use of these materials requires a knowledge of their dielectric properties. To do so, a rigorous characterization of these materials has been established, and we used to characterize our materials. We present in this section a technique for extracting the permittivity and permeability of high-k materials from measurements of planar transmission lines.
  • Keywords
    dielectric losses; high-k dielectric thin films; microstrip lines; permeability; permittivity; dielectric losses; dielectric materials; dielectric properties; high permittivity; high-k materials; material characterization; microelectronics; microstrip line; permeability; planar transmission line measurement; Dielectric measurements; Dielectrics; High K dielectric materials; Microelectronics; Permittivity; Transmission line measurements; Electric characterization; coaxial probe; complex permittivity; multilayer materials; semiconductor materials; thin layer dielectric; transmission-line;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mediterranean Microwave Symposium (MMS), 2011 11th
  • Conference_Location
    Hammamet
  • ISSN
    2157-9822
  • Print_ISBN
    978-1-4577-1814-4
  • Electronic_ISBN
    2157-9822
  • Type

    conf

  • DOI
    10.1109/MMS.2011.6068580
  • Filename
    6068580