DocumentCode
2215145
Title
Filling of carbon nanotube forests grown by atmospheric pressure PECVD
Author
Chandrashekar, A. ; Ramachandran, S. ; Pollack, G.P. ; Lee, J.S. ; Lee, G.S. ; Overzet, L.J.
Author_Institution
Univ. of Texas at Dallas, Richardson
Volume
1
fYear
2006
fDate
22-25 Oct. 2006
Firstpage
278
Lastpage
279
Abstract
This presentation examines aspects of the growth and filling of carbon nanotube forests. Composites containing CNTs are predicted to inherit the best properties of the CNTs (strength, toughness, resistivity, thermal conductivity). However, good dispersion of the CNTs is vitally important in fabricating composites with features approaching those theoretically predicted. Significant deterioration of the composite properties has been shown to occur when the CNTs agglomerate rather than being uniformly dispersed. Filling as-grown CNT forests with various materials can result in a composite with excellent CNT dispersion. Furthermore, the growth of forests is becoming very popular for both single-wall and multi-wall CNTs of high quality. LPCVD is a very good technique to fill the CNT forests with a wide variety of materials, so we have studied the filling process on various forests. Filling begins by coating the individual CNTs with the (inorganic) material. Large coating thicknesses bridge the gap between adjacent CNTs and result in a continuous composite layer. Polysilicon/CNT composites fabricated under conditions that yield good step coverage were found to exhibit hardness similar to that of bulk polysilicon and high fracture toughness but also high sheet resistance. Voids deep inside films over 25 microns thick remain a significant issue.
Keywords
atmospheric structure; carbon nanotubes; coating techniques; composite materials; fracture toughness; thermal conductivity; atmospheric pressure; bulk polysilicon; carbon nanotube forests; coating thicknesses; composite fabrication; continuous composite layer; fracture toughness; sheet resistance; thermal conductivity; Bridges; Carbon nanotubes; Coatings; Composite materials; Conducting materials; Filling; Inorganic materials; Sheet materials; Thermal conductivity; Thermal resistance; Carbon Nanotube; Composites; Low Pressure Chemical Vapor Deposition (CVD); Plasma Enhanced CVD;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location
Gyeongju
Print_ISBN
978-1-4244-0541-1
Electronic_ISBN
978-1-4244-0541-1
Type
conf
DOI
10.1109/NMDC.2006.4388865
Filename
4388865
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