• DocumentCode
    2215145
  • Title

    Filling of carbon nanotube forests grown by atmospheric pressure PECVD

  • Author

    Chandrashekar, A. ; Ramachandran, S. ; Pollack, G.P. ; Lee, J.S. ; Lee, G.S. ; Overzet, L.J.

  • Author_Institution
    Univ. of Texas at Dallas, Richardson
  • Volume
    1
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    278
  • Lastpage
    279
  • Abstract
    This presentation examines aspects of the growth and filling of carbon nanotube forests. Composites containing CNTs are predicted to inherit the best properties of the CNTs (strength, toughness, resistivity, thermal conductivity). However, good dispersion of the CNTs is vitally important in fabricating composites with features approaching those theoretically predicted. Significant deterioration of the composite properties has been shown to occur when the CNTs agglomerate rather than being uniformly dispersed. Filling as-grown CNT forests with various materials can result in a composite with excellent CNT dispersion. Furthermore, the growth of forests is becoming very popular for both single-wall and multi-wall CNTs of high quality. LPCVD is a very good technique to fill the CNT forests with a wide variety of materials, so we have studied the filling process on various forests. Filling begins by coating the individual CNTs with the (inorganic) material. Large coating thicknesses bridge the gap between adjacent CNTs and result in a continuous composite layer. Polysilicon/CNT composites fabricated under conditions that yield good step coverage were found to exhibit hardness similar to that of bulk polysilicon and high fracture toughness but also high sheet resistance. Voids deep inside films over 25 microns thick remain a significant issue.
  • Keywords
    atmospheric structure; carbon nanotubes; coating techniques; composite materials; fracture toughness; thermal conductivity; atmospheric pressure; bulk polysilicon; carbon nanotube forests; coating thicknesses; composite fabrication; continuous composite layer; fracture toughness; sheet resistance; thermal conductivity; Bridges; Carbon nanotubes; Coatings; Composite materials; Conducting materials; Filling; Inorganic materials; Sheet materials; Thermal conductivity; Thermal resistance; Carbon Nanotube; Composites; Low Pressure Chemical Vapor Deposition (CVD); Plasma Enhanced CVD;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
  • Conference_Location
    Gyeongju
  • Print_ISBN
    978-1-4244-0541-1
  • Electronic_ISBN
    978-1-4244-0541-1
  • Type

    conf

  • DOI
    10.1109/NMDC.2006.4388865
  • Filename
    4388865