Transparent electrooptical nanocomposite thick films by serosol deposition method for application to ultrahigh-speed optical switches

Author

Park, Jae-Hyuk ; Akedo, Jun

Author_Institution

Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki

Volume

1

fYear

2006

fDate

22-25 Oct. 2006

Firstpage

298

Lastpage

299

Abstract

We prepared high transparent electrooptical gold/lead zirconate titanate (PZT) nanocomposite thick films by aerosol deposition method (ADM) for the first time and report their enhanced surface plasmon resonance (SPR) properties. ADM has been attracting much attention for its ability to deposit complex composite films at a high deposition rate and a low process temperature. Composite metal-dielectric powders are prepared from submicron particles of PZT and nano particles of gold (10-40 nm) with concentrations below 1 wt%. Nanocomposite gold/PZT 3-mum-thick film acquired enhanced SPR at approximately 640 nm as a result of annealing. The SPR position in nanocomposite films deposited by ADM can be precisely controlled by adjusting the dielectric constant of the host matrix by annealing.. Moreover, nano gold particles were spatially very well distributed in the PZT matrix and showed no growth in spite of annealing at 600degC.

Keywords

aerosols; dielectric materials; electro-optical devices; gold; lead; nanocomposites; optical switches; surface plasmon resonance; thick films; aerosol deposition method; composite metal-dielectric powders; lead zirconate titanate nanocomposite thick; nano gold particles; size 10 nm to 40 nm; size 3 mum; surface plasmon resonance properties; temperature 600 C; transparent electrooptical gold; transparent electrooptical nanocomposite thick films; ultrahigh-speed optical switches; Aerosols; Annealing; Gold; Optical films; Optical switches; Plasmons; Resonance; Temperature; Thick films; Titanium compounds; PZT; aerosol deposition method; nanocomposite; nanometal; surface plasmon resonance;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE

Conference_Location

Gyeongju

Print_ISBN

978-1-4244-0541-1

Electronic_ISBN

978-1-4244-0541-1

Type

conf

DOI

10.1109/NMDC.2006.4388872

Filename

4388872