DocumentCode
2215415
Title
Effect of Ti-Substitution on temperature dependence and magnetic disaccommodation of MnZn ferrites
Author
Ji, H.N. ; Lan, Z.W. ; Yu, Z. ; Zhi, Y.J. ; Liu, Z.
Author_Institution
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2009
fDate
25-27 Sept. 2009
Firstpage
344
Lastpage
347
Abstract
Ti-Substituted MnZn ferrites were prepared by the conventional ceramic process. The effects of Ti-Substitution on temperature dependence and magnetic disaccommodation of MnZn ferrites were investigated. The experimental results show that the valley between peak I and Peak II of the mui-T curve initially becomes flatter with higher Titanium content. However, if increasing Titanium content continually, the valley becomes steep eventually. Furthermore, at the same temperature section of the valley, an initial decrease followed by a subsequent increase in the intensity of peak II of disaccommodation spectra is observed with the increase in Titanium content. The valley becomes flatter when the peak II of disaccommodation spectra goes down. MnZn ferrite with low peak II of disaccommodation spectra and high thermal stability is achieved when the substitution of Ti4+ is 0.1 mol%.
Keywords
ferrites; magnetic aftereffect; magnetic permeability; manganese compounds; materials preparation; thermal stability; titanium compounds; zinc compounds; MnOZnOTiO2Fe2O3; conventional ceramic process; ferrites; magnetic disaccommodation; mui-T curve; permeability; thermal stability; Ferrites; Magnetic materials; Magnetosphere; Permeability; Powders; Saturation magnetization; Switched-mode power supply; Temperature dependence; Titanium; Toroidal magnetic fields; MnZn ferrite; Ti; disaccommodation; switch mode power supply; temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Superconductivity and Electromagnetic Devices, 2009. ASEMD 2009. International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-3686-6
Electronic_ISBN
978-1-4244-3687-3
Type
conf
DOI
10.1109/ASEMD.2009.5306624
Filename
5306624
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