• DocumentCode
    2215415
  • Title

    Effect of Ti-Substitution on temperature dependence and magnetic disaccommodation of MnZn ferrites

  • Author

    Ji, H.N. ; Lan, Z.W. ; Yu, Z. ; Zhi, Y.J. ; Liu, Z.

  • Author_Institution
    State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2009
  • fDate
    25-27 Sept. 2009
  • Firstpage
    344
  • Lastpage
    347
  • Abstract
    Ti-Substituted MnZn ferrites were prepared by the conventional ceramic process. The effects of Ti-Substitution on temperature dependence and magnetic disaccommodation of MnZn ferrites were investigated. The experimental results show that the valley between peak I and Peak II of the mui-T curve initially becomes flatter with higher Titanium content. However, if increasing Titanium content continually, the valley becomes steep eventually. Furthermore, at the same temperature section of the valley, an initial decrease followed by a subsequent increase in the intensity of peak II of disaccommodation spectra is observed with the increase in Titanium content. The valley becomes flatter when the peak II of disaccommodation spectra goes down. MnZn ferrite with low peak II of disaccommodation spectra and high thermal stability is achieved when the substitution of Ti4+ is 0.1 mol%.
  • Keywords
    ferrites; magnetic aftereffect; magnetic permeability; manganese compounds; materials preparation; thermal stability; titanium compounds; zinc compounds; MnOZnOTiO2Fe2O3; conventional ceramic process; ferrites; magnetic disaccommodation; mui-T curve; permeability; thermal stability; Ferrites; Magnetic materials; Magnetosphere; Permeability; Powders; Saturation magnetization; Switched-mode power supply; Temperature dependence; Titanium; Toroidal magnetic fields; MnZn ferrite; Ti; disaccommodation; switch mode power supply; temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices, 2009. ASEMD 2009. International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-3686-6
  • Electronic_ISBN
    978-1-4244-3687-3
  • Type

    conf

  • DOI
    10.1109/ASEMD.2009.5306624
  • Filename
    5306624