DocumentCode
2215489
Title
Simulation of vertical channel nanoscale MOSFETs for low leakage DRAM cell
Author
Song, Seung-Hyun ; Lee, Jeong-Soo ; Jeong, Yoon-Ha
Author_Institution
Dept. of Electron. & Electr. Eng., Pohang Univ. of Sci. & Technol., Pohang
Volume
1
fYear
2006
fDate
22-25 Oct. 2006
Firstpage
512
Lastpage
513
Abstract
A vertical channel nanoscale MOSFET for low leakage dynamic random access memory (DRAM) cell is proposed. Due to longer channel length than that of the conventional planner structure, the vertical channel structure can dramatically reduce short channel effect (SCE). This structure features a source extension to enhance subthreshold swing (SS), and a neck sidewall spacer to reduce gate induced drain leakage (GIDL).
Keywords
DRAM chips; MOSFET; dynamic random access memory; gate induced drain leakage; low leakage DRAM cell; planner structure; short channel effect; subthreshold swing; vertical channel nanoscale MOSFET; Costs; DRAM chips; Degradation; Implants; Lithography; MOSFETs; Nanostructures; Neck; Production; Random access memory; DRAM; MOSFETs; Vertical channel;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location
Gyeongju
Print_ISBN
978-1-4244-0540-4
Electronic_ISBN
978-1-4244-0541-1
Type
conf
DOI
10.1109/NMDC.2006.4388879
Filename
4388879
Link To Document