Title :
Thermal Analysis of DLBI (Die Level Burn In) Carrier
Author :
Park, Mike ; Khalil, Waleed
Author_Institution :
Intel Corporation
Keywords :
Biomembranes; Current density; Metallization; Microprocessors; Predictive models; Temperature dependence; Testing; Thermal conductivity; Thermal resistance; Very large scale integration;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
DOI :
10.1109/IRWS.1993.666313
