• DocumentCode
    2215627
  • Title

    Cost effective process for high-efficiency solar cells

  • Author

    Lee, S.H.

  • Author_Institution
    Dept. of Electron. Eng., Sejong Univ., Seoul
  • Volume
    1
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    526
  • Lastpage
    528
  • Abstract
    A new method for patterning the rear passivation layers of high-efficiency solar cells with a mechanical scriber has been developed and successfully adapted to fabricate high-efficiency passivated emitter and rear cell (PERC). Three types of the rear contact patterns: dot patterns with a photolithography process, line and dashed line patterns with a mechanical scriber process have been processed in order to optimize the rear contact structure. An efficiency of 19.42% has been achieved on the mechanical-scribed (MS)-PERC solar cell on 0.5 Omegacm p-type FZ-Si wafer and is comparable to that of conventional PERC solar cells fabricated by using photolithography process. The mechanical scriber process shows great potential for commercial applications by achieving high efficiency above 20% and by significantly reducing the fabrication costs without an expensive photolithography process. Low cost Ni/Cu metal contact has been formed by using a low cost electroless and electroplating. Nickel silicide formation at the interface enhances stability and reduces the contact resistance resulting in an energy conversion efficiency of 20.2 % on 0.5 Omegacm FZ wafer.
  • Keywords
    copper alloys; electroplating; nickel alloys; solar cells; dashed line patterns; dot patterns; electroplating; high-efficiency solar cells; mechanical scriber; mechanical-scribed -PERC solar cell; nickel silicide formation; passivated emitter and rear cell; photolithography process; rear contact patterns; rear passivation layers; Contact resistance; Costs; Energy conversion; Fabrication; Lithography; Nickel; Passivation; Photovoltaic cells; Silicides; Stability; Contact; Copper; Mechanical scriber; Nickel; Plating; Solar cell;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
  • Conference_Location
    Gyeongju
  • Print_ISBN
    978-1-4244-0540-4
  • Electronic_ISBN
    978-1-4244-0541-1
  • Type

    conf

  • DOI
    10.1109/NMDC.2006.4388886
  • Filename
    4388886