DocumentCode :
2215702
Title :
VLSI Metallization Screening Using Normalized Conductance Method
Author :
Mohanti, Tapan ; Fu, Kuan-Yu
Author_Institution :
Clemson University
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
204
Lastpage :
205
Keywords :
Current density; Fixtures; Metallization; Numerical simulation; Polyimides; Temperature dependence; Testing; Thermal resistance; Very large scale integration; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666314
Filename :
666314
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2215702
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