DocumentCode
2216175
Title
Temperature-aware binding for clock skew reduction based on switching activity balancing
Author
Jihyung Kim ; Kim, Jihyung ; Park, Sungho ; Cho, Jun-dong
Author_Institution
Syst. LSI Div., Samsung Electron. Co., Ltd., Yongin, South Korea
Volume
1
fYear
2010
fDate
20-22 Aug. 2010
Abstract
Recently, various physical level issues are considered in advance at the stage of high-level synthesis to save cost and get better performance or lower power. Among the issues, temperature variation is widely studied, but to the best of our knowledge, the bus binding method in high-level synthesis to consider clock skew distortion due to non-uniform distribution of temperature has not been proposed. In this paper, we propose binding method to aim at reducing clock skew by balancing switching activity of bus binding, and hence, by making the distribution of temperature uniform. Experimental result shows that the proposed method obtains binding solutions having 36.5-63.5% lower variance of switching activities among all bus groups in comparison to the existing binding method that does not consider the effect of temperature variation. Consequently, our heuristic binding method effectively reduces clock skew by 19.6-46.0% for seven benchmark circuits.
Keywords
benchmark testing; distortion; switching circuits; temperature distribution; benchmark circuits; bus binding; clock skew reduction; high-level synthesis; nonuniform temperature distribution; physical level issues; switching activities; switching activity balancing; temperature variation; temperature-aware binding; Finite impulse response filter; Fires; Lattices; Switches; bus binding; clock skew; high-level; switching activity; temperature-aware;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Computer Theory and Engineering (ICACTE), 2010 3rd International Conference on
Conference_Location
Chengdu
ISSN
2154-7491
Print_ISBN
978-1-4244-6539-2
Type
conf
DOI
10.1109/ICACTE.2010.5579045
Filename
5579045
Link To Document