Title :
Preparation of ultra-fine copper powder and its application in manufacturing conductive lines by printed electronics technology
Author :
Yang, Ying ; Wang, Shouxu ; He, Wei ; Hu, Ke ; He, Bo ; Mo, Yunqi
Author_Institution :
Sch. of Microelectron. & Solid-State Electron., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
Ultra-fine copper powder was prepared by ball milling solid phase reaction in ambient condition. Ctystallinity of the synthesized copper powder was investigated using an X-ray diffraction, while the morphology of the copper particles was studied via scanning electron microscopy. The energy dispersive spectroscopy peaks and the analysis of resultant particles´ components were also presented. The resultant particles were protected from oxidation by atmospheric air, by the use of benzotriazole. Face-centered cubic copper particles with about 200 nm in diameter were obtained. The resultant powder was impurity-free and shows good stability.
Keywords :
ball milling; copper; crystal morphology; printed circuit manufacture; X-ray diffraction; ball milling; benzotriazole; conductive line; copper particle morphology; energy dispersive spectroscopy; printed electronics technology; scanning electron microscopy; solid phase reaction; ultra-fine copper powder; Ball milling; Copper; Dispersion; Manufacturing; Morphology; Powders; Scanning electron microscopy; Solids; Spectroscopy; X-ray diffraction; ball milling reaction; conductive inks; conductive lines; printed electronics technology; ultra-fine copper powder;
Conference_Titel :
Applied Superconductivity and Electromagnetic Devices, 2009. ASEMD 2009. International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-3686-6
Electronic_ISBN :
978-1-4244-3687-3
DOI :
10.1109/ASEMD.2009.5306675
