Synthesis and dielectric properties of poly(epoxyimide)-nano silica hybrid film by CS sol process

Author

Han, Se Won ; Han, Dong Hee ; Kang, Dong Pil ; Kang, Young Taec ; Kim, Suck Jun

Author_Institution

Korea Electrotechnol. Res. Inst., Changwon

Volume

1

fYear

2006

fDate

22-25 Oct. 2006

Firstpage

624

Lastpage

625

Abstract

The new PEI-ano Silica hybrid films prepared from CS sol process have a stable chemical bonding and uniform distribution of nano silica. The decrease property of dielectric constant with CS content, and tangent loss consistent of given frequency and temperature was explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. PEI-CS sol hybrid film with such stable chemical and dielectric properties is expected to be used as high functional coating application in ET, IT and electric power products.

Keywords

bonds (chemical); dielectric losses; filled polymers; nanocomposites; nanostructured materials; nanotechnology; organic-inorganic hybrid materials; permittivity; silicon compounds; sol-gel processing; chemical bonding; dielectric constant; hybrid film; nano silica; poly(epoxy-imide); sol process; tangent loss; Bonding; Chemical processes; Chemical products; Coatings; Dielectric constant; Dielectric losses; Frequency; Polymers; Silicon compounds; Temperature; CS sol; PEI-Silica bybrid; dielectric constant and tangent loss; nano silica dipersion;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE

Conference_Location

Gyeongju

Print_ISBN

978-1-4244-0540-4

Electronic_ISBN

978-1-4244-0541-1

Type

conf

DOI

10.1109/NMDC.2006.4388934

Filename

4388934