DocumentCode
2216838
Title
Using FSV in high-speed channel characterization and correlation
Author
Zhang, Ji ; Zhang, Jianmin ; Lim, Jane ; Qiu, Kelvin ; Brooks, Rick ; Chen, Bill
Author_Institution
Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fYear
2012
fDate
6-10 Aug. 2012
Firstpage
690
Lastpage
695
Abstract
In modern high performance networking systems, high-speed channels are among the most concerns due to the channel loss, discontinuities and crosstalk as data rate reaches 15 Gbps (Gigabit per second) and above through backplane. Full-wave modeling and system level simulations are widely used to estimate the performance for high-speed channels. Due to the variations and uncertainties associated with the simulation and manufacturing, correlation between simulation and measurement is often used to gain confidence on the channel performance prediction. In this paper, a high-speed channel including the portion inside a high-end ASIC (Application-Specific Integrated Circuit) package and the portion on a PCB (Printed Circuit Board) are investigated. The FSV (Feature Selection Validation) method is used to correlate the channel simulation and measurement, and quantitative conclusions between modeling and measurement are given for the studied channels.
Keywords
application specific integrated circuits; crosstalk; integrated circuit interconnections; integrated circuit packaging; printed circuits; ASIC; FSV; PCB; application specific integrated circuit; bit rate 15 Gbit/s; channel loss; channel performance prediction; channel simulation; crosstalk; feature selection validation; full-wave modeling; high performance networking systems; high speed channel characterization; insertion loss; printed circuit board; system level simulations; Application specific integrated circuits; Correlation; Dielectric loss measurement; Histograms; Integrated circuit modeling; Loss measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on
Conference_Location
Pittsburgh, PA
ISSN
2158-110X
Print_ISBN
978-1-4673-2061-0
Type
conf
DOI
10.1109/ISEMC.2012.6351650
Filename
6351650
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