• DocumentCode
    2216838
  • Title

    Using FSV in high-speed channel characterization and correlation

  • Author

    Zhang, Ji ; Zhang, Jianmin ; Lim, Jane ; Qiu, Kelvin ; Brooks, Rick ; Chen, Bill

  • Author_Institution
    Missouri Univ. of Sci. & Technol., Rolla, MO, USA
  • fYear
    2012
  • fDate
    6-10 Aug. 2012
  • Firstpage
    690
  • Lastpage
    695
  • Abstract
    In modern high performance networking systems, high-speed channels are among the most concerns due to the channel loss, discontinuities and crosstalk as data rate reaches 15 Gbps (Gigabit per second) and above through backplane. Full-wave modeling and system level simulations are widely used to estimate the performance for high-speed channels. Due to the variations and uncertainties associated with the simulation and manufacturing, correlation between simulation and measurement is often used to gain confidence on the channel performance prediction. In this paper, a high-speed channel including the portion inside a high-end ASIC (Application-Specific Integrated Circuit) package and the portion on a PCB (Printed Circuit Board) are investigated. The FSV (Feature Selection Validation) method is used to correlate the channel simulation and measurement, and quantitative conclusions between modeling and measurement are given for the studied channels.
  • Keywords
    application specific integrated circuits; crosstalk; integrated circuit interconnections; integrated circuit packaging; printed circuits; ASIC; FSV; PCB; application specific integrated circuit; bit rate 15 Gbit/s; channel loss; channel performance prediction; channel simulation; crosstalk; feature selection validation; full-wave modeling; high performance networking systems; high speed channel characterization; insertion loss; printed circuit board; system level simulations; Application specific integrated circuits; Correlation; Dielectric loss measurement; Histograms; Integrated circuit modeling; Loss measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4673-2061-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2012.6351650
  • Filename
    6351650