DocumentCode
2216999
Title
MMIC Design Techniques for Low-Cost High-Volume Commercial Modules
Author
Hubert, John
Author_Institution
Xytrans, 5422 Carrier Dr, 32819 Orlando, USA (407) 370-9031
fYear
2003
fDate
Oct. 2003
Firstpage
887
Lastpage
890
Abstract
This paper presents several MMIC design techniques that focus on module cost reduction and general MMIC component requirements relative to point-to-point and point-to-multipoint terrestrial, as well as two-way satellite, low-cost high-volume communication module needs. Currently, MMIC vendors concentrate on improving performance and reducing MMIC cost. Low-cost high-volume modules impose additional requirements relating to MMIC compatibility with module volume production processes. The MMIC design techniques discussed include: circuit compaction, use of external support components, maximizing symmetry, reduction of external connections, compatibility with automatic bonding machines, compatibility with automatic pick-and-place machines, and standardizing RF probe types. General MMIC requirements relative to module needs for both terrestrial and satellite communication links are also discussed.
Keywords
Artificial satellites; Bonding; Circuits; Compaction; Costs; MMICs; Probes; Process design; Production; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2003 33rd European
Conference_Location
Munich, Germany
Print_ISBN
1-58053-834-7
Type
conf
DOI
10.1109/EUMA.2003.341104
Filename
4143160
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