• DocumentCode
    2217476
  • Title

    Electrical and structural properties of PZT/ST films

  • Author

    Lee, Sang Heon ; Choi, Yong

  • Author_Institution
    Dept. of Electron. Eng., Sun Moon Univ., Asan
  • Volume
    1
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    692
  • Lastpage
    693
  • Abstract
    The heterolayered thick/thin structure consisting of Pb(Zr0.52Ti0.48)O3 (PZT) and SrTiO3(ST) were fabricated by a sol-gel process. We investigated the effect of phase, composition, and interfacial state of SrTiO3 thin films layer at interface between PZT thick films. The structural and the dielectric properties were investigated for effect of various stacking sequence of sol-gel-prepared SrTiO3 layer at interface of PZT thick films. The insertion of SrTiO3 interlayer yielded PZT thick films with homogeneous and dense grain structure regardless of the number of SrTiO3 layers. These results suggested that there is coexistence of PZT phase and SrTiO3 phase or presence of the modified SrTiO3 at the interfaces between PZT thick. The leakage current density of the PZT/SrTiO3-7 film is less that 1.7 x 10-9 A/cm2 at S V.
  • Keywords
    crystal microstructure; current density; dielectric thin films; interface states; lead compounds; leakage currents; sol-gel processing; strontium compounds; PZT; PZT thick films; SrTiO3; SrTiO3 - System; SrTiO3 interlayer; SrTiO3 thin films; dense grain structure; dielectric properties; electrical properties; heterolayered thick structure; heterolayered thin structure; interfacial state; leakage current density; sol-gel process; structural properties; Ceramics; Coatings; Dielectric substrates; Dielectric thin films; Powders; Printing; Sun; Thick films; Transistors; X-ray scattering; PZT; dielectric propery; heterolayer; sol-gel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
  • Conference_Location
    Gyeongju
  • Print_ISBN
    978-1-4244-0540-4
  • Electronic_ISBN
    978-1-4244-0541-1
  • Type

    conf

  • DOI
    10.1109/NMDC.2006.4388964
  • Filename
    4388964