DocumentCode :
2217589
Title :
Transient effect of DC stressed dielectric breakdown in thin SiO2 films
Author :
Toriumi, Akira ; Satake, Hideki
Author_Institution :
Dept. of Mater. Sci., Tokyo Univ., Japan
Volume :
2
fYear :
2001
fDate :
22-25 Oct. 2001
Firstpage :
936
Abstract :
A post-breakdown resistance of SiO2 has been studied as a quantitative monitor to describe the dielectric breakdown characteristics. First, the usefulness of post-breakdown SiO2 analysis is discussed on the basis of experimental results. Clear differences between dry and wet oxides or stress polarities are shown in terms of the post-breakdown resistance of SiO2 as well as the charge-to-breakdown. Then, the soft- and hard- breakdowns typically observed in sub-10 nm SiO2 are discussed qualitatively but statistically. A main point discussed is to consider a time constant in MOS closed circuit including a sample itself just at the dielectric breakdown. The results imply that the intrinsic parasitic effects become more important in modeling and assessment of scaled-down CMOS device reliability.
Keywords :
CMOS integrated circuits; dielectric thin films; electric breakdown; integrated circuit reliability; silicon compounds; CMOS device reliability; SiO2; charge-to-breakdown; dielectric breakdown; dry oxides; intrinsic parasitic effects; post-breakdown resistance; stress polarities; time constant; transient effect; wet oxides; Dielectric breakdown; Dielectric measurements; Dielectric thin films; Electric breakdown; Electrical resistance measurement; MOS capacitors; Materials science and technology; Mechanical factors; Research and development; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN :
0-7803-6520-8
Type :
conf
DOI :
10.1109/ICSICT.2001.982049
Filename :
982049
Link To Document :
بازگشت