DocumentCode
2217704
Title
Thermal properties of quantum transition process in piezoelectric materials based on the projected Liouville equation.
Author
Sug, Joung-Young ; Lee, Su-Ho ; Sa-Gong, Geon
Author_Institution
Electron. & Electr. Eng. Sch., Kyungpook Nat. Univ., Taegu
Volume
1
fYear
2006
fDate
22-25 Oct. 2006
Firstpage
712
Lastpage
713
Abstract
We study the temperature dependence of the Cyclotron Resonance absorption Line Shapes(CRLS) and the Cyclotron Resonance Line Widths(CRLW) in piezoelectric materials, CdS and GaAs. We examined theoretically the CRLS and CRLW in the quantum limit due to piezoelectric phonon scattering. We use the projected Liouville equation method approach. Trough the numerical calculation of the result of the theory, we find that the width increases with the temperature in two materials. We also find that the temperature dependence of the CRLW of the phonon emission process is more larger than the temperature dependence of the CRLW of the phonon absorption process.
Keywords
III-V semiconductors; Liouville equation; cadmium compounds; cyclotron resonance; gallium arsenide; piezoelectric materials; wide band gap semiconductors; CdS; CdS - Binary; GaAs; GaAs - Binary; cyclotron resonance absorption line shapes; cyclotron resonance line widths; phonon absorption; phonon emission; piezoelectric materials; piezoelectric phonon scattering; projected Liouville equation; quantum transition; temperature dependence; thermal properties; Absorption; Cyclotrons; Equations; Gallium arsenide; Particle scattering; Phonons; Piezoelectric materials; Quantum mechanics; Resonance; Temperature dependence; Electron piezoelectric phonon coupling system; Projected Liouville equation method; the Cyclotron Resonance Line Widths(CRLW); the Cyclotron Resonance absorption Line Shapes(CRLS);
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location
Gyeongju
Print_ISBN
978-1-4244-0540-4
Electronic_ISBN
978-1-4244-0541-1
Type
conf
DOI
10.1109/NMDC.2006.4388974
Filename
4388974
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