Title :
[Copyright notice]
Abstract :
The following topics are dealt with: semiconductor industry; phase-locked loops; MOS capacitor; ultra-wideband CMOS T/R switch; 3D IC integration; organic thin film technology; OLED-on-CMOS based bidirectional microdisplay; high-voltage IGBT; high temperature power electronics packaging; RF transceivers; interconnection; MEMS module integration; delta sigma modulator; atomic force microscopy; RFID transponders; CMOS-3D image sensor; power amplifier; transimpedance amplifier; MOSFET; OLED microdisplay; and serial non-volatile sRAM.
Keywords :
CMOS image sensors; MOSFET; SRAM chips; integrated circuit interconnections; micromechanical devices; organic light emitting diodes; phase locked loops; power amplifiers; semiconductor industry; transceivers; 3D IC integration; CMOS-3D image sensor; MEMS module integration; MOS capacitor; MOSFET; OLED microdisplay; OLED-on-CMOS based bidirectional microdisplay; RF transceivers; RFID transponders; atomic force microscopy; delta sigma modulator; high temperature power electronics packaging; high-voltage IGBT; interconnection; organic thin film technology; phase-locked loops; power amplifier; semiconductor industry; serial nonvolatile sRAM; transimpedance amplifier; ultra-wideband CMOS T-R switch;
Conference_Titel :
Semiconductor Conference Dresden (SCD), 2011
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-0431-4
DOI :
10.1109/SCD.2011.6068703
