[Copyright notice]

fYear

2011

fDate

27-28 Sept. 2011

Firstpage

1

Lastpage

1

Abstract

The following topics are dealt with: semiconductor industry; phase-locked loops; MOS capacitor; ultra-wideband CMOS T/R switch; 3D IC integration; organic thin film technology; OLED-on-CMOS based bidirectional microdisplay; high-voltage IGBT; high temperature power electronics packaging; RF transceivers; interconnection; MEMS module integration; delta sigma modulator; atomic force microscopy; RFID transponders; CMOS-3D image sensor; power amplifier; transimpedance amplifier; MOSFET; OLED microdisplay; and serial non-volatile sRAM.

Keywords

CMOS image sensors; MOSFET; SRAM chips; integrated circuit interconnections; micromechanical devices; organic light emitting diodes; phase locked loops; power amplifiers; semiconductor industry; transceivers; 3D IC integration; CMOS-3D image sensor; MEMS module integration; MOS capacitor; MOSFET; OLED microdisplay; OLED-on-CMOS based bidirectional microdisplay; RF transceivers; RFID transponders; atomic force microscopy; delta sigma modulator; high temperature power electronics packaging; high-voltage IGBT; interconnection; organic thin film technology; phase-locked loops; power amplifier; semiconductor industry; serial nonvolatile sRAM; transimpedance amplifier; ultra-wideband CMOS T-R switch;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference Dresden (SCD), 2011

Conference_Location

Dresden

Print_ISBN

978-1-4577-0431-4

Type

conf

DOI

10.1109/SCD.2011.6068703

Filename

6068703