Title :
Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)
Abstract :
The following topics were dealt with: infrastructure issues; new MCM applications; flip-chip MCMs; mixed-signal MCMs; electrical design; design optimization; computer-aided design; advances in MCM technology; interconnect modeling
Keywords :
circuit CAD; circuit optimisation; flip-chip devices; integrated circuit design; integrated circuit packaging; mixed analogue-digital integrated circuits; multichip modules; MCM applications; MCM technology; computer-aided design; design optimization; electrical design; flip-chip MCMs; interconnect modeling; mixed-signal MCMs; multi-chip module;
Conference_Titel :
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location :
Santa Cruz, CA, USA
Print_ISBN :
0-8186-7286-2
DOI :
10.1109/MCMC.1996.510759
