Thermal performance characteristic comparison between flip-chip wirebond ceramic multichip modules

Author

Yuan, T.U.

Author_Institution

IBM Microelectron., Hopewell Junction, NY, USA

fYear

1996

fDate

6-7 Feb 1996

Firstpage

44

Lastpage

48

Abstract

Multichip module (MCM) thermal performance for flip chip and wirebond (WE) die attach packages are evaluated using four chip, uniform size ceramic substrates. Thermal characteristics of each module are evaluated by conduction parametric analyser of individual module element properties and dimensions. Thermal performance is evaluated for conditions ranging from low air now and no heat sink to high air flow with high profile heat sinks. Flip chip modules are shown to be thermally superior to WB packages in both cavity up and cavity down configurations

Keywords

ceramics; flip-chip devices; microassembling; multichip modules; substrates; cavity down configurations; cavity up configurations; conduction parametric analyser; flip-chip wirebond ceramic multichip modules; high profile heat sinks; thermal performance; thermal performance characteristic; uniform size ceramic substrates; Boundary conditions; Ceramics; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Equations; Geometry; Integrated circuit interconnections; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-7286-2

Type

conf

DOI

10.1109/MCMC.1996.510767

Filename

510767