Title :
Thermal performance characteristic comparison between flip-chip wirebond ceramic multichip modules
Author_Institution :
IBM Microelectron., Hopewell Junction, NY, USA
Abstract :
Multichip module (MCM) thermal performance for flip chip and wirebond (WE) die attach packages are evaluated using four chip, uniform size ceramic substrates. Thermal characteristics of each module are evaluated by conduction parametric analyser of individual module element properties and dimensions. Thermal performance is evaluated for conditions ranging from low air now and no heat sink to high air flow with high profile heat sinks. Flip chip modules are shown to be thermally superior to WB packages in both cavity up and cavity down configurations
Keywords :
ceramics; flip-chip devices; microassembling; multichip modules; substrates; cavity down configurations; cavity up configurations; conduction parametric analyser; flip-chip wirebond ceramic multichip modules; high profile heat sinks; thermal performance; thermal performance characteristic; uniform size ceramic substrates; Boundary conditions; Ceramics; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Equations; Geometry; Integrated circuit interconnections; Temperature; Thermal conductivity;
Conference_Titel :
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7286-2
DOI :
10.1109/MCMC.1996.510767
