CAD tools for multi-radio high-frequency design

Author

Hussein, Yasser A.

Author_Institution

PedaSoft LLC, Chandler, AZ, USA

fYear

2012

fDate

15-17 April 2012

Firstpage

1

Lastpage

4

Abstract

Advances in technology have enabled the possibilities to integrate multi-band and multi-mode radios into single packaged chips covering the diversity of communication standards from 2G GSM, 3G UMTS, to 4G LTE and LTE-advanced as well as WLAN, BT, and GPS impart unique challenges on the RF CAD due to the high complexity and integration of such chips. This requires simulation of the package as a whole to include electromagnetic coupling, interference, and radiation. The focus in this paper will be on the challenges and requirements as well as the latest trends on multi-radio CAD. A thorough discussion of advanced techniques for receivers and transmitters modeling of multi-radio SoC or SiP will be presented.

Keywords

electromagnetic coupling; radio receivers; radio transmitters; radiofrequency integrated circuits; radiofrequency interference; system-in-package; system-on-chip; technology CAD (electronics); 2G GSM; 3G UMTS; 4G LTE; CAD tools; GPS; LTE-advanced; RF CAD; SiP; WLAN; communication standards; electromagnetic coupling; electromagnetic interference; electromagnetic radiation; multiband radios; multimode radios; multiradio SoC; multiradio high-frequency design; receiver modeling; single packaged chips; transmitter modeling; Couplings; Design automation; Integrated circuit modeling; Layout; Radio frequency; Solid modeling; Transistors; CAD tools; RF design; modling; multi-radio; simulation;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless and Microwave Technology Conference (WAMICON), 2012 IEEE 13th Annual

Conference_Location

Cocoa Beach, FL

Print_ISBN

978-1-4673-0129-9

Electronic_ISBN

978-1-4673-0128-2

Type

conf

DOI

10.1109/WAMICON.2012.6208481

Filename

6208481