DocumentCode
2218212
Title
New global insight in ultra-thin oxide reliability using accurate experimental methodology and theoretical modeling
Author
Wu, Ernest ; Suñé, Jordi
Author_Institution
IBM Microelectron. Div., Essex Junction, VT, USA
Volume
2
fYear
2001
fDate
22-25 Oct. 2001
Firstpage
1025
Abstract
We critically examine several important aspects concerning ultra-thin oxide reliability. Time- or charge-to-breakdown (TBD/QBD) measurements with high statistical accuracy are carried out over a wide range of oxide thickness (Tox), voltages, temperatures, and test structures. Thickness dependence of Weibull slopes and its physical interpretation based on a simple analytic model are reviewed. We also investigate the voltage-dependent voltage acceleration using two independent experimental methods of long-term module stress and area scaling techniques. In the context of voltage-dependent voltage acceleration, we resolve various seemingly contradicting and confusing observations such as the strong temperature dependence of oxide breakdown observed on ultra-thin oxides, temperature-independent voltage acceleration at a fixed TBD, and non-Arrhenius temperature dependence found on ultra-thin oxides. Using a newly developed kinetic approach for oxide breakdown, we propose a two-step hydrogen model as an alternative to explain the experimental observations on voltage-dependent voltage acceleration and temperature dependence of oxide breakdown.
Keywords
MOS capacitors; MOSFET; Weibull distribution; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; semiconductor device testing; CMOS technology; MOS capacitors; Weibull slopes; analytic model; area scaling; charge-to-breakdown measurements; constant voltage stress; critical defect density; high statistical accuracy; kinetic approach; long-term module stress; nFETs; nonArrhenius temperature dependence; oxide breakdown; oxide thickness dependence; pFETs; temperature dependence; temperature-independent voltage acceleration; test structures; time-to-breakdown; two-step hydrogen model; ultra-thin oxide reliability; voltage-dependent voltage acceleration; Acceleration; Breakdown voltage; Current measurement; Q measurement; Reliability theory; Stress; Temperature dependence; Temperature distribution; Testing; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN
0-7803-6520-8
Type
conf
DOI
10.1109/ICSICT.2001.982071
Filename
982071
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