• DocumentCode
    2218212
  • Title

    New global insight in ultra-thin oxide reliability using accurate experimental methodology and theoretical modeling

  • Author

    Wu, Ernest ; Suñé, Jordi

  • Author_Institution
    IBM Microelectron. Div., Essex Junction, VT, USA
  • Volume
    2
  • fYear
    2001
  • fDate
    22-25 Oct. 2001
  • Firstpage
    1025
  • Abstract
    We critically examine several important aspects concerning ultra-thin oxide reliability. Time- or charge-to-breakdown (TBD/QBD) measurements with high statistical accuracy are carried out over a wide range of oxide thickness (Tox), voltages, temperatures, and test structures. Thickness dependence of Weibull slopes and its physical interpretation based on a simple analytic model are reviewed. We also investigate the voltage-dependent voltage acceleration using two independent experimental methods of long-term module stress and area scaling techniques. In the context of voltage-dependent voltage acceleration, we resolve various seemingly contradicting and confusing observations such as the strong temperature dependence of oxide breakdown observed on ultra-thin oxides, temperature-independent voltage acceleration at a fixed TBD, and non-Arrhenius temperature dependence found on ultra-thin oxides. Using a newly developed kinetic approach for oxide breakdown, we propose a two-step hydrogen model as an alternative to explain the experimental observations on voltage-dependent voltage acceleration and temperature dependence of oxide breakdown.
  • Keywords
    MOS capacitors; MOSFET; Weibull distribution; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; semiconductor device testing; CMOS technology; MOS capacitors; Weibull slopes; analytic model; area scaling; charge-to-breakdown measurements; constant voltage stress; critical defect density; high statistical accuracy; kinetic approach; long-term module stress; nFETs; nonArrhenius temperature dependence; oxide breakdown; oxide thickness dependence; pFETs; temperature dependence; temperature-independent voltage acceleration; test structures; time-to-breakdown; two-step hydrogen model; ultra-thin oxide reliability; voltage-dependent voltage acceleration; Acceleration; Breakdown voltage; Current measurement; Q measurement; Reliability theory; Stress; Temperature dependence; Temperature distribution; Testing; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
  • Print_ISBN
    0-7803-6520-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2001.982071
  • Filename
    982071