DocumentCode
2218230
Title
A new multichip-on-silicon packaging scheme with integrated passive components
Author
Guérin, L. ; Sachot, R. ; Dutoit, M.
Author_Institution
Inst. for Micro- and Optoelectron., Swiss Federal Inst. of Technol., Lausanne, Switzerland
fYear
1996
fDate
6-7 Feb 1996
Firstpage
73
Lastpage
77
Abstract
A new multichip-on-silicon packaging scheme for microelectronic circuits, sensors and actuators is presented. Its main characteristics and advantages over other schemes are discussed. A description of some key fabrication steps is given. Finally, the realization and the characterization of passive integrated components such as inductors and capacitors are discussed
Keywords
microactuators; microassembling; microsensors; multichip modules; silicon; surface topography; MCM; MIM capacitors; Si surfaces; actuators; fabrication; inductors; integrated passive components; microelectronic circuits; multichip-on-silicon packaging; rough surface bonding; sensors; Actuators; Circuits; Etching; MIM capacitors; Metal-insulator structures; Microelectronics; Packaging; Sensor phenomena and characterization; Silicon; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-7286-2
Type
conf
DOI
10.1109/MCMC.1996.510772
Filename
510772
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