DocumentCode
2218342
Title
Process and materials characterization using low energy secondary ion mass spectrometry (SIMS)
Author
Lu, Shifeng ; Patel, Sajay
Author_Institution
Motorola Inc., Mesa, AZ, USA
Volume
2
fYear
2001
fDate
22-25 Oct. 2001
Firstpage
1054
Abstract
Secondary ion mass spectrometry (SIMS) is a widely used metrology technique for the characterization of semiconductor materials. The shrinking of feature size has lead to a new generation of SIMS tools capable of accurately analyzing advanced process technology and new materials. These tools offer high depth resolution by using very low primary beam energies. Quadrupole based SIMS tools have proven to be the best choice for using low energy beams, as the design offers several key advantages: independent incidence angle and energy variation allowing optimization of die SIMS parameters for specific applications, low extraction fields allow low energy ions to reach the sample surface without distortion, high level of reproducibility is achieved on a routine basis and a low cost of ownership compared to other types of SIMS instruments. In this study, a quadruple SIMS tool (ATOMIKA 4500™) that has floating low energy ion guns (FLIG™) to generate the low energy ions, was used to analyze a variety of different samples. For example, shallow boron implants and SiGe HBT samples. This paper will discuss the benefits of using quadruple SIMS for analyzing these new materials in a manufacturing environment.
Keywords
Ge-Si alloys; boron; doping profiles; heterojunction bipolar transistors; secondary ion mass spectra; ATOMIKA 4500; FLIG; SIMS; SiGe; SiGe HBT; floating low energy ion guns; low energy ions; low energy secondary ion mass spectrometry; quadrupole SIMS; semiconductor materials; shallow boron implants; Boron; Cost function; Design optimization; Energy resolution; Guns; Instruments; Mass spectroscopy; Metrology; Reproducibility of results; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN
0-7803-6520-8
Type
conf
DOI
10.1109/ICSICT.2001.982078
Filename
982078
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