DocumentCode :
2218675
Title :
Performance projection and thermal management of high performance VLSI designs
Author :
Wang, L.K. ; Chen, Howard I. ; Yuan, Tsorng-Dih ; Bor Zen Hong
Author_Institution :
Res. Div., IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Volume :
2
fYear :
2001
fDate :
22-25 Oct. 2001
Firstpage :
1107
Abstract :
The impact of chip self-heating induced temperature non-uniformity within the VLSI chip and its influence on the performance of the designs are described in this paper. To accurately model chip performance, both electrical and thermal analysis including chip packaging should be examined together. This paper describes a methodology that allows more accurate temperature calculation of the chip based on circuit power analysis, together with thermal analysis that studies the on chip temperature distribution in order to improve the accuracy of existing methods to account for on chip temperature gradients and perform an overall performance prediction and adjustment. A computational fluid dynamics analysis is used in this study to address non-uniform power distribution temperature calculation for high power integrated circuits. Examples are given and results discussed with highlighted conclusions.
Keywords :
VLSI; computational fluid dynamics; integrated circuit design; integrated circuit packaging; power integrated circuits; temperature distribution; thermal management (packaging); thermal resistance; VLSI chip; chip packaging; chip performance modeling; chip self-heating induced temperature nonuniformity; chip temperature calculation; circuit power analysis; computational fluid dynamics analysis; electrical analysis; high performance VLSI designs; high power integrated circuits; nonuniform power distribution temperature calculation; on chip temperature distribution; on chip temperature gradients; performance projection; thermal analysis; thermal management; thermal spreading resistance; Circuit analysis; Computational fluid dynamics; Packaging; Performance analysis; Power distribution; Power integrated circuits; Project management; Temperature distribution; Thermal management; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN :
0-7803-6520-8
Type :
conf
DOI :
10.1109/ICSICT.2001.982092
Filename :
982092
Link To Document :
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