Correlation based local measurement of small CTE for high temperature power electronics packaging

Author

Hammacher, J. ; Dost, M. ; Seiler, B. ; Scheiter, L. ; Noack, E. ; Rzepka, S. ; Michel, B.

Author_Institution

Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany

fYear

2011

fDate

27-28 Sept. 2011

Firstpage

1

Lastpage

4

Abstract

The image based displacement analysis called Digital Image Correlation (DIC) can be used as an alternative to classical TMA and other bulk methods to measure CTE-values of electronic packaging materials. By combining the operation of the thermally optimized commercial equipment EQUINOX from the company OMI and the correlation software VEDDAC of CWM GmbH Chemnitz, it was possible to develop a method to acquire anisotropic CTE values of specimens locally and with an accuracy of +/- 0.5*10^-6 /K over the entire value scale.

Keywords

correlation methods; electronic engineering computing; electronics packaging; image processing; power electronics; CWM GmbH Chemnitz; DIC; EQUINOX; VEDDAC; correlation based local measurement; correlation software; digital image correlation; high temperature power electronics packaging; image based displacement analysis; small CTE; thermally optimized commercial equipment; Correlation; Displacement measurement; Materials; Measurement uncertainty; Optical variables measurement; Reliability; Temperature measurement; CTE; digital image correlation; non-destructive testing; reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference Dresden (SCD), 2011

Conference_Location

Dresden

Print_ISBN

978-1-4577-0431-4

Type

conf

DOI

10.1109/SCD.2011.6068734

Filename

6068734