New olefinic interlevel dielectric materials for multi-chip modules

A new class of materials derived from addition polymers of cyclic olefins is described. The general properties of these polymers include Tg greater than 350°C, dielectric constant less than 2.6, low moisture absorption and good elongation-to-break. These materials have also been modified to have excellent adhesion to commonly used materials such as silica and aluminum. In addition, excellent adhesion has been achieved to copper and noble metals such as gold and silver. These polymers are shown to adhere even in the absence of an adhesion promoter or tie layer on the metal (e.g. titanium, tantalum, chromium) and to remain as adherent films even after being placed in boiling water for 2 hours. These materials are expected to demonstrate utility in electronic applications and interconnection by offering superior performance over traditional materials while reducing the device manufacturing cost