• DocumentCode
    2219097
  • Title

    Recent advances and issues in SiC process and device technologies

  • Author

    Ostling, Mikael ; Koo, S.M. ; Lee, S.-K. ; Danielsson, E. ; Zetterling, C.-M.

  • Author_Institution
    Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol., Kista, Sweden
  • Volume
    2
  • fYear
    2001
  • fDate
    22-25 Oct. 2001
  • Firstpage
    1173
  • Abstract
    Silicon carbide (SiC) is a wide band-gap semiconductor material with potential applications for high power, high frequency, and high temperature devices. Commercially available substrates and devices together with the shown experimental prototypes show very good promises for the future while still a continued improvement in fabrication techniques and wafer substrates are required for economically viable production. The recent advances and critical issues in SiC device process technology and the current state-of-the art devices in SiC are reviewed.
  • Keywords
    semiconductor technology; silicon compounds; substrates; wide band gap semiconductors; SiC; SiC device process technology; fabrication technique; high frequency device; high power device; high temperature device; silicon carbide; wafer substrate; wide band gap semiconductor; Fabrication; Frequency; Power generation economics; Production; Prototypes; Semiconductor materials; Silicon carbide; Substrates; Temperature; Wide band gap semiconductors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
  • Print_ISBN
    0-7803-6520-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2001.982108
  • Filename
    982108