DocumentCode
2219097
Title
Recent advances and issues in SiC process and device technologies
Author
Ostling, Mikael ; Koo, S.M. ; Lee, S.-K. ; Danielsson, E. ; Zetterling, C.-M.
Author_Institution
Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol., Kista, Sweden
Volume
2
fYear
2001
fDate
22-25 Oct. 2001
Firstpage
1173
Abstract
Silicon carbide (SiC) is a wide band-gap semiconductor material with potential applications for high power, high frequency, and high temperature devices. Commercially available substrates and devices together with the shown experimental prototypes show very good promises for the future while still a continued improvement in fabrication techniques and wafer substrates are required for economically viable production. The recent advances and critical issues in SiC device process technology and the current state-of-the art devices in SiC are reviewed.
Keywords
semiconductor technology; silicon compounds; substrates; wide band gap semiconductors; SiC; SiC device process technology; fabrication technique; high frequency device; high power device; high temperature device; silicon carbide; wafer substrate; wide band gap semiconductor; Fabrication; Frequency; Power generation economics; Production; Prototypes; Semiconductor materials; Silicon carbide; Substrates; Temperature; Wide band gap semiconductors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN
0-7803-6520-8
Type
conf
DOI
10.1109/ICSICT.2001.982108
Filename
982108
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