• DocumentCode
    2220245
  • Title

    Analysis of common-mode noise on on-chip differential lines through stochastic modeling of parameter variability

  • Author

    Ginste, Dries Vande ; De Zutter, Daniël ; Deschrijver, Dirk ; Dhaene, Tom ; Manfredi, Paolo ; Canavero, Flavio

  • Author_Institution
    Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
  • fYear
    2012
  • fDate
    6-10 Aug. 2012
  • Firstpage
    144
  • Lastpage
    149
  • Abstract
    In this contribution a novel stochastic modeling strategy to analyze the influence of parameter variability on differential signaling over on-chip interconnects is presented. The method starts from an accurate computation of the differential line´s per unit of length transmission line parameters, adopts a parameterized macromodeling scheme, and invokes the so-called stochastic Galerkin method (SGM). Parameter variability of the line itself and of the terminations are studied and compared to a traditional Monte Carlo (MC) approach, as such demonstrating excellent accuracy and efficiency of the proposed new technique. For the first time, an SGM is constructed for and applied to differential on-chip interconnects, and it is illustrated that this novel stochastic modeling strategy is very well suited to analyze common-mode noise induced by random imbalance of the line´s terminations.
  • Keywords
    Galerkin method; differential equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; common mode noise analysis; differential signaling; line termination; on-chip differential lines; on-chip interconnect; parameter variability; random imbalance; stochastic Galerkin method; stochastic modeling; transmission line parameter; Equations; Integrated circuit interconnections; Mathematical model; Noise; Standards; Stochastic processes; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4673-2061-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2012.6351794
  • Filename
    6351794