• DocumentCode
    2220881
  • Title

    Test data compression and compaction for embedded test of nanometer technology designs

  • Author

    Rajski, Janusz ; Tyszer, Jerzy

  • Author_Institution
    Mentor Graphics Corp., Wilsonville, OR, USA
  • fYear
    2003
  • fDate
    13-15 Oct. 2003
  • Firstpage
    331
  • Lastpage
    336
  • Abstract
    We examine various forms of embedded deterministic test with particular emphasis on input stimuli compression and test response compaction schemes. Subsequently, the embedded deterministic test (EOT) scheme, which significantly reduces manufacturing test cost by providing a dramatic reduction in scan test data volume and scan test time, is discussed.
  • Keywords
    automatic test pattern generation; boundary scan testing; data compression; design for testability; embedded systems; fault diagnosis; embedded deterministic test; manufacturing test cost; nanometer technology designs; scan test data volume; scan test time; test data compression; test response compaction schemes; Automatic test pattern generation; Automatic testing; Circuit faults; Circuit testing; Compaction; Copper; Costs; Design for testability; Test data compression; Test pattern generators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design, 2003. Proceedings. 21st International Conference on
  • ISSN
    1063-6404
  • Print_ISBN
    0-7695-2025-1
  • Type

    conf

  • DOI
    10.1109/ICCD.2003.1240915
  • Filename
    1240915