Title :
Carbon nanostructure enhanced reinforcements in electromagnetic compatibility applications
Author :
Hartman, David ; Claussen, Greg ; VanHouten, Desmond
Author_Institution :
Owens Corning Sci. & Technol., Granville, OH, USA
Abstract :
Carbon enhanced reinforcements (CER) for multifunctional composite design were recently developed using technology where carbon nanostructures (CNS) are synthesized on the surface of glass fibers in a continuous, in-line, production scalable process. The hybrid reinforcement results in a highly conductive multifunctional capability in thermoset and thermoplastic resins that enables excellent electromagnetic interference (EMI) shielding performance. This paper discusses the development and industrialization of the carbon nanostructure-glass fiber hybrid pelletized in thermoplastic masterbatches of polycarbonate-acrylonitrile-butadiene-styrene (PC/ABS), polyamide-6,6 (PA-6,6), polycarbonate (PC), and polypropylene (PP). It reviews the electrical, thermal and mechanical properties of the compounds for engineered solutions in injection molded electromagnetic compatability (EMC) applications.
Keywords :
electromagnetic compatibility; electromagnetic interference; electromagnetic shielding; glass fibres; nanostructured materials; CER; CNS; EMC applications; EMI shielding performance; carbon nanostructure enhanced reinforcements; electrical properties; electromagnetic compatibility applications; electromagnetic interference shielding performance; glass fibers surface; hybrid reinforcement; injection molded electromagnetic compatability; mechanical properties; multifunctional composite design; polyamide-6,6; polycarbonate; polycarbonate-acrylonitrile-butadiene-styrene; polypropylene; production scalable process; thermal properties; thermoplastic masterbatches; thermoplastic resins; thermoset resins; Carbon dioxide; Conductivity; Electromagnetic interference; Loading; Materials; Optical fiber dispersion; Reflection;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on
Conference_Location :
Pittsburgh, PA
Print_ISBN :
978-1-4673-2061-0
DOI :
10.1109/ISEMC.2012.6351832