• DocumentCode
    2223377
  • Title

    FLIP: a platform to integrate embodied agent technology

  • Author

    Jensen, Lars Kock ; Kristensen, Bent Bruun ; Demazeau, Yves

  • Author_Institution
    Maersk Mc-Kinney Moller Inst. for Production Technol., Univ. of Southern Denmark, Odense, Denmark
  • fYear
    2003
  • fDate
    13-16 Oct. 2003
  • Firstpage
    103
  • Lastpage
    110
  • Abstract
    Flexibility and adaptability are essential properties of intelligent manufacturing systems. However, it is a major challenge to realize these properties and it is expensive to develop prototypes that are authentic and at the same time useful with respect to integration of state-of-the-art technologies in the area of agents and artificial intelligence. The use of cheap and flexible, yet realistic platforms is a necessity if we want to overcome these challenges. In this paper we present a flexible platform for prototyping multi-agent systems consisting of a heterogeneous set of cooperating robots. We present the diverse technologies that make up the prototype and address the issue of integrating such technologies into a general agent architecture. We finally evaluate on the experimental results based on a set of criteria that we believe have major significance in the context of flexible manufacturing systems.
  • Keywords
    flexible manufacturing systems; industrial robots; intelligent manufacturing systems; mobile robots; multi-agent systems; multi-robot systems; FLIP; artificial intelligence; cooperating robots; embodied agent technology; flexible manufacturing system; intelligent manufacturing system; multiagent systems; state-of-the-art technology; Artificial intelligence; Electrical equipment industry; Flexible manufacturing systems; Intelligent agent; Intelligent manufacturing systems; Multiagent systems; Optimized production technology; Production systems; Prototypes; Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Agent Technology, 2003. IAT 2003. IEEE/WIC International Conference on
  • Print_ISBN
    0-7695-1931-8
  • Type

    conf

  • DOI
    10.1109/IAT.2003.1241055
  • Filename
    1241055