Title :
An improved chip level thermal analysis algorithm using BEM
Author :
Cui, Mingdong ; Zhao, Wenqing ; Tang, Pushan
Author_Institution :
Microelectron. Dept., Fudan Univ., Shanghai, China
Abstract :
The increasing number of thermal-related problems in VLSI circuit led to the requirement for more efficient temperature analysis tools. In this paper, we developed an algorithm to calculate temperature profile using BEM, our method can handle large amount of heat-sources, thus surface temperature profile and inner profile could be calculated quickly and accurately
Keywords :
VLSI; boundary-elements methods; integrated circuit modelling; temperature distribution; thermal analysis; BEM; VLSI circuit; chip-level thermal analysis algorithm; heat source; inner temperature profile; surface temperature profile; Algorithm design and analysis; Boundary conditions; Computational complexity; Equations; Failure analysis; High speed integrated circuits; Microelectronics; Statistical analysis; Temperature distribution; Very large scale integration;
Conference_Titel :
ASIC, 2001. Proceedings. 4th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6677-8
DOI :
10.1109/ICASIC.2001.982525
