DocumentCode
2224650
Title
An improved chip level thermal analysis algorithm using BEM
Author
Cui, Mingdong ; Zhao, Wenqing ; Tang, Pushan
Author_Institution
Microelectron. Dept., Fudan Univ., Shanghai, China
fYear
2001
fDate
2001
Firstpage
175
Lastpage
178
Abstract
The increasing number of thermal-related problems in VLSI circuit led to the requirement for more efficient temperature analysis tools. In this paper, we developed an algorithm to calculate temperature profile using BEM, our method can handle large amount of heat-sources, thus surface temperature profile and inner profile could be calculated quickly and accurately
Keywords
VLSI; boundary-elements methods; integrated circuit modelling; temperature distribution; thermal analysis; BEM; VLSI circuit; chip-level thermal analysis algorithm; heat source; inner temperature profile; surface temperature profile; Algorithm design and analysis; Boundary conditions; Computational complexity; Equations; Failure analysis; High speed integrated circuits; Microelectronics; Statistical analysis; Temperature distribution; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC, 2001. Proceedings. 4th International Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-6677-8
Type
conf
DOI
10.1109/ICASIC.2001.982525
Filename
982525
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