• DocumentCode
    2225360
  • Title

    Simulated annealing search through general structure floorplans using sequence-pair

  • Author

    Kiyota, Koji ; Fujiyoshi, Kunihiro

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Tokyo Univ. of Agric. & Technol., Japan
  • Volume
    3
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    77
  • Abstract
    VLSI floorplan is a rectangular dissection of a chip rectangle where dissection lines correspond to wiring channels and each module is assigned to a separate room. Floorplans are often represented by the slicing structures. Recently, sequence-pair (seq-pair) has been proposed as the description of the rectangle packing and later on a method to map a seq-pair to a floorplan has been proposed. However, such floorplans made of seq-pairs often include rooms with no module assigned, and so it is difficult to make good solution space by seq-pair. In this paper, we propose a novel solution space of floorplans for simulated annealing (SA) which consists of the all general floorplans with exact n rooms, where n is the number of given modules, using seq-pair. By using ingenious data structure, a feasible adjacent floorplan can be obtained in O(n2) time and the reachability from any floorplan to any other in the proposed solution space is proved. The experimental results show the effectiveness of the solution space
  • Keywords
    VLSI; circuit layout CAD; data structures; integrated circuit layout; reachability analysis; simulated annealing; VLSI floorplan; data structure; general structure floorplans; reachability; rectangle packing; sequence-pair; simulated annealing search; solution space; wiring channels; Agricultural engineering; Agriculture; Data structures; Simulated annealing; Sufficient conditions; Very large scale integration; Wire; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2000. Proceedings. ISCAS 2000 Geneva. The 2000 IEEE International Symposium on
  • Conference_Location
    Geneva
  • Print_ISBN
    0-7803-5482-6
  • Type

    conf

  • DOI
    10.1109/ISCAS.2000.856000
  • Filename
    856000