Title :
VACNT-on-silicon platform for improving heat conduction in optoelectronic packaging
Author :
Chen, Szu-Chieh ; Lo, Hsinyi ; Hung, Yung-Jr ; Pan, Yen-Ting ; Lee, San-Liang ; Ram, Rajeev J.
Author_Institution :
Dept. of Electron. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
Abstract :
Silicon platforms with high-density vertically aligned carbon nanotubes on patterned substrates are designed to provide efficient thermal transfer for optoelectronic chips. 20% increase in output power is obtained when applying for LED packaging.
Keywords :
carbon nanotubes; electronics packaging; heat conduction; light emitting diodes; LED packaging; VACNT-on-silicon platform; heat conduction; high-density vertically aligned carbon nanotubes; optoelectronic packaging; patterned substrates; Electronic packaging thermal management; Heating; Light emitting diodes; Silicon; Thermal conductivity; Thermal resistance;
Conference_Titel :
Lasers and Electro-Optics (CLEO), 2011 Conference on
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4577-1223-4
