Title :
Evaluation of phosphorus diffusion in the confined nano-wire under the influence of Si/SiO2 interface
Author :
Seike, Aya ; Sano, Itsutaku ; Yamada, Keisaku ; Ohdomari, Iwao
Author_Institution :
Sch. of Sci. & Eng., Waseda Univ., Tokyo
fDate :
Jan. 30 2006-Feb. 1 2006
Abstract :
Diffusion of phosphorus is studied by means of electrical measurement of the Si-wire devices and SIMS profiles of bulk SOI. The conductivity of Si-wire decreases as the thermal budget increases. The sample of 80 nm in the designed width (Wmask), of which the actual width after the oxidation is 57.4 nm, has higher conductivity, which is the factor of 3 to 4.5, with respect to the theoretical value of bulk Si. We assume that the stress applied from the peripheral SiO2 influence on the phosphorus diffusion in Si. Segregation of phosphorus ions at both cap-SiO2/Si(SOI) and Si(SOI)/SiO2(BOX) is recognized, however, no dependency of SIMS profiles on the thermal budget is confirmed. Dose loss of phosphorus due to the diffusion into the cap-SiO2 is about 1*1019 cm-3. The result of dependency of conductivity on the thermal budged doesnpsilat coincide with the data of SIMS profiles. This is because the SIMS profile of bulk sample doesnpsilat provide the lateral information nor reflect the effect of stress from the peripheral SiO2 film. Further investigation will be needed to reveal the relation between the size effect on the conductivity and the stress from the peripheral SiO2.
Keywords :
diffusion; electrical conductivity; nanowires; phosphorus; segregation; silicon-on-insulator; P; SOI; Si-SiO2; Si-wire devices; conductivity; confined nanowire; phosphorus diffusion; secondary ion mass spectra; segregation; size 57.4 nm; Dielectric films; Dry etching; Electrodes; Lithography; MOSFETs; Nanoscale devices; Thermal conductivity; Thermal stresses; Transistors; Wire; IV characterization; SIMS; Si nanowire; Si/SiO2 interface; diffusion; electrical properties; phosphorus; pile-up; segregatkon;
Conference_Titel :
Nano CMOS, 2006 International Workshop on
Conference_Location :
Mishima
Print_ISBN :
978-1-4244-0603-6
DOI :
10.1109/IWNC.2006.4570985