DocumentCode :
2226878
Title :
New findings in nano-scale interface physics and their relations to nano-CMOS technologies
Author :
Shiraishi, K. ; Akasaka, Y. ; Torii, K. ; Nakayama, T. ; Miyazaki, S. ; Nakaoka, T. ; Watanabe, H. ; Ohmori, K. ; Ahmet, P. ; Chikyow, T. ; Nara, Y. ; Yamada, K.
Author_Institution :
Grad. Sch. of Pure & Appl. Sci., Tsukuba Univ., Tsukuba
fYear :
2006
fDate :
Jan. 30 2006-Feb. 1 2006
Firstpage :
180
Lastpage :
208
Abstract :
We show the new findings in nano-scale interface physics and atomistic behaviors of defects in gate dielectric materials. In this paper, we first discuss the relation between defect behaviors and transistor characteristics. Next, we introduce our newly prosed mechanism of Fermi level pinning governed by the interface reaction. Further, we show that conventional charge neutrality level concept does not applicable to metal/high-k dielectric interfaces, and we propose a generalized charge neutrality level concept that includes both nano-scale interface structures and metal band structures. Finally, we discuss the atomistic investigation on the characteristics of conventional Si/SiO2 nano interfaces.
Keywords :
CMOS integrated circuits; Fermi level; dielectric materials; nanoelectronics; silicon compounds; work function; Fermi level pinning; Si-SiO2; atomistic behaviors; charge neutrality level concept; defect behaviors; effective work functions; gate dielectric materials; interface reaction; metal band structures; metal/high-k dielectric interfaces; nanoCMOS technologies; nanoscale interface physics; transistor characteristics; Electrons; Hafnium oxide; High-K gate dielectrics; Laboratories; Large scale integration; Lead compounds; Leakage current; Materials science and technology; Nanotechnology; Physics; Defect; Effective work functions; Fermi level pinnig; High-k dielectrics; Inteface; Reliability; Si; SiO2; Theory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano CMOS, 2006 International Workshop on
Conference_Location :
Mishima
Print_ISBN :
978-1-4244-0603-6
Type :
conf
DOI :
10.1109/IWNC.2006.4570992
Filename :
4570992
Link To Document :
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