• DocumentCode
    2226890
  • Title

    Local-property analysis for modeling of gate insulator materials

  • Author

    Doi, Kentaro ; Nakamura, Koichi ; Tachibana, Akitomo

  • Author_Institution
    Dept. of Micro Eng., Kyoto Univ., Kyoto
  • fYear
    2006
  • fDate
    Jan. 30 2006-Feb. 1 2006
  • Firstpage
    209
  • Lastpage
    235
  • Abstract
    We have constructed fundamental theories for electronic properties and dielectric breakdown of gate insulator materials in nano-CMOS devices based on the Rigged QED theory and the regional density functional theory. Simulations about dielectric properties and reliability due to these theories have been carried out for SiO2, ZrO2, HfO2, ZrxSi1-xO2, HfxSi1-xO2, GdxOy, LaxOy, and SiOxNy through the modeling of nano-CMOS system such as crystal and amorphous thin films. Furthermore, we have reported development of the nucleus-electron multiple dynamics program codes following the Rigged QED theory.
  • Keywords
    CMOS integrated circuits; electric breakdown; gadolinium compounds; hafnium compounds; insulating materials; integrated circuit modelling; integrated circuit reliability; lanthanum compounds; nanoelectronics; silicon compounds; zirconium compounds; GdxOy; HfxSi1-xOz; HfO2; LaxOy; Rigged QED theory; SiO2; SiOxNy; ZrxSi1-xOz; ZrO2; amorphous thin Elms; crystal thin Elms; dielectric breakdown; functional theory; gate insulator materials; local-property analysis; nanoCMOS devices; nucleus-electron multiple dynamics program codes; Amorphous materials; Density functional theory; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Hafnium oxide; Nanoscale devices; Nanostructured materials; Reliability theory; Zirconium; Dielectric property; IWNC; La oxide; Nano CMOS; Regional density functional theory; Reliability; Rigged QED theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano CMOS, 2006 International Workshop on
  • Conference_Location
    Mishima
  • Print_ISBN
    978-1-4244-0603-6
  • Type

    conf

  • DOI
    10.1109/IWNC.2006.4570993
  • Filename
    4570993