• DocumentCode
    2227516
  • Title

    Chip-scale multiple quantum well based optical interconnects

  • Author

    Nair, Rohit ; Gu, Tian ; Teitelbaum, Michael E. ; Goossen, Keith W. ; Kiamilev, Fouad ; Haney, Michael W.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
  • fYear
    2011
  • fDate
    1-6 May 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Hybrid integration of multiple quantum well modulators with silicon is proposed for implementing chip-scale optical interconnects. Polymer waveguides with curved facets are used to couple light in and out of the MQW devices.
  • Keywords
    CMOS integrated circuits; III-V semiconductors; aluminium compounds; gallium arsenide; hybrid integrated circuits; integrated circuit interconnections; optical interconnections; optical modulation; optical polymers; optical waveguides; quantum well devices; GaAs-AlAs; Si; chip scale multiple quantum well; hybrid integration; multiple quantum well modulator; optical interconnects; polymer waveguides; Couplings; Fabrics; Gallium arsenide; Optical device fabrication; Optical interconnections; Optical waveguides; Quantum well devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics (CLEO), 2011 Conference on
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-4577-1223-4
  • Type

    conf

  • Filename
    5950126
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2227516