Title :
Package and interconnect modeling of the HFA3624, a 2.4 GHz RF to IF converter
Author :
Kamon, Mattan ; Majors, Steve S.
Author_Institution :
Res. Lab. of Electron., MIT, Cambridge, MA, USA
Abstract :
This paper demonstrates the use of three-dimensional electromagnetic field solvers to accurately model the interconnect for a 2.4 GHz RF to IF converter integrated circuit under development at Harris Semiconductor. Lumped element RLC models for the package leads, bondwires, die attach plane, and on-chip interconnect are shown to provide accurate simulation versus measurement and prove the importance of modeling the entire packaged IC
Keywords :
UHF frequency convertors; UHF integrated circuits; bipolar analogue integrated circuits; inductance; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; lead bonding; lumped parameter networks; 2.4 GHz; 2.4 GHz RF to IF converter integrated circuit; HFA3624; bondwires; die attach plane; interconnect modeling; lumped element RLC models; on-chip interconnect; package leads; three-dimensional electromagnetic field solvers; Bonding; Electromagnetic fields; Electromagnetic modeling; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Lead; Radio frequency; Radiofrequency integrated circuits; Semiconductor device packaging;
Conference_Titel :
Design Automation Conference Proceedings 1996, 33rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-3294-6
DOI :
10.1109/DAC.1996.545535
