DocumentCode :
2229027
Title :
Quality factor and microslipping of fatigue cracks in thin plates at resonant vibration
Author :
Wincheski, B. ; Namkung, M.
Author_Institution :
Anal. Services & Mater. Inc., Hampton, VA
fYear :
1993
fDate :
31 Oct-3 Nov 1993
Firstpage :
673
Abstract :
Resonant vibrations have been stimulated in thin metal plates using a non-contacting electromagnetic driver. A sinusoidal force was applied in a swept frequency fashion and the resulting surface displacements were monitored through the use of an acoustic microphone. It has been found that the presence of a fatigue crack in the sample causes a broadening of the second resonance peak. The Q factors of the resonance curves were determined and are directly correlated with the presence of fatigue cracks in the samples. The broadening of the curves is explained in terms of a microslipping at the crack face walls which reduces the amplitude of the resonant vibration by increasing the damping of the system. A comparison is made between the resonance characteristics of fatigue damaged and notched samples, where the stiffness of the two systems is nearly constant while the interaction between crack face walls is eliminated in the latter
Keywords :
acoustic emission testing; crack detection; fatigue cracks; ultrasonic materials testing; Q factors; acoustic microphone; crack face walls; fatigue crack; fatigue crack microslipping; noncontacting electromagnetic driver; notched samples; quality factor; resonant vibration; sinusoidal force; thin metal plates; thin plates; Acoustic emission; Damping; Electromagnetic forces; Fatigue; Force sensors; Microphones; Monitoring; Q factor; Resonance; Resonant frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1993. Proceedings., IEEE 1993
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-2012-3
Type :
conf
DOI :
10.1109/ULTSYM.1993.339491
Filename :
339491
Link To Document :
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