• DocumentCode
    2229027
  • Title

    Quality factor and microslipping of fatigue cracks in thin plates at resonant vibration

  • Author

    Wincheski, B. ; Namkung, M.

  • Author_Institution
    Anal. Services & Mater. Inc., Hampton, VA
  • fYear
    1993
  • fDate
    31 Oct-3 Nov 1993
  • Firstpage
    673
  • Abstract
    Resonant vibrations have been stimulated in thin metal plates using a non-contacting electromagnetic driver. A sinusoidal force was applied in a swept frequency fashion and the resulting surface displacements were monitored through the use of an acoustic microphone. It has been found that the presence of a fatigue crack in the sample causes a broadening of the second resonance peak. The Q factors of the resonance curves were determined and are directly correlated with the presence of fatigue cracks in the samples. The broadening of the curves is explained in terms of a microslipping at the crack face walls which reduces the amplitude of the resonant vibration by increasing the damping of the system. A comparison is made between the resonance characteristics of fatigue damaged and notched samples, where the stiffness of the two systems is nearly constant while the interaction between crack face walls is eliminated in the latter
  • Keywords
    acoustic emission testing; crack detection; fatigue cracks; ultrasonic materials testing; Q factors; acoustic microphone; crack face walls; fatigue crack; fatigue crack microslipping; noncontacting electromagnetic driver; notched samples; quality factor; resonant vibration; sinusoidal force; thin metal plates; thin plates; Acoustic emission; Damping; Electromagnetic forces; Fatigue; Force sensors; Microphones; Monitoring; Q factor; Resonance; Resonant frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1993. Proceedings., IEEE 1993
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    0-7803-2012-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1993.339491
  • Filename
    339491