Title :
Study on self-heat effects in integrated circuits with hot-spot and electro-thermal coupling methods
Author :
Miao, Liu ; Runde, Zhou ; Songliang, Jia ; Yuqin, Gu ; Xingang, Liang ; Ronghai, Zhang
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
The self-heat effects in integrated circuits have great impact on circuit performance and power consumption. Based on HSPICE circuit simulator and improved Hot-Spot thermal analysis, this paper presents a new fast electro-thermal relaxation method to study the self-heat effects. Given the layout information and the input signal pattern, the developed method may calculate the temperature distribution of a chip, and investigate the chip performance under the distribution. With infrared thermal image system, the measured temperature distribution of the facsimile thermal printing head ASIC chip agrees very well with the simulation result
Keywords :
SPICE; VLSI; application specific integrated circuits; circuit CAD; infrared imaging; integrated circuit design; low-power electronics; power consumption; relaxation; temperature distribution; thermal analysis; ASIC; HSPICE circuit simulator; IR thermal image system; electro-thermal relaxation; facsimile thermal printing head; hot-spot thermal analysis; integrated circuits; power consumption; self-heat effects; temperature distribution; Analytical models; Circuit optimization; Circuit simulation; Energy consumption; Facsimile; Infrared imaging; Relaxation methods; Semiconductor device measurement; Temperature distribution; Temperature measurement;
Conference_Titel :
ASIC, 2001. Proceedings. 4th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6677-8
DOI :
10.1109/ICASIC.2001.982705
