An electromagnetic technique for packaging problem analysis

Author

Krause, K.E. ; Spielman, B.E.

Author_Institution

Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA

Volume

2

fYear

1996

fDate

17-21 June 1996

Firstpage

1067

Abstract

A new three-dimensional electromagnetic packaging analysis is developed for shielded configurations containing arbitrarily shaped, homogeneous, isotropic regions. Computer implementation uses and extends routines from a computational engine for electromagnetic scattering. The packaging analysis is validated using rectangular waveguide configurations. Preliminary analysis is performed on a filtering structure.

Keywords

computer aided analysis; electrical engineering computing; electromagnetic shielding; electromagnetic wave scattering; packaging; rectangular waveguides; waveguide theory; 3D electromagnetic packaging analysis; EM scattering computational engine; electromagnetic technique; filtering structure; packaging problem analysis; rectangular waveguide configurations; shielded configurations; three-dimensional electromagnetic analysis; Boundary conditions; Electric variables measurement; Electromagnetic analysis; Electromagnetic measurements; Electromagnetic scattering; Equations; Geometry; Packaging; Reflection; Writing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1996., IEEE MTT-S International

Conference_Location

San Francisco, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-3246-6

Type

conf

DOI

10.1109/MWSYM.1996.511214

Filename

511214