Title :
A 2-axis comb-driven micromirror array for 3D MEMS switches
Author :
Mizuno, Y. ; Tsuboi, O. ; Kouma, N. ; Soneda, H. ; Okuda, H. ; Nakamura, Y. ; Ueda, S. ; Sawaki, I. ; Yamagishi, F.
Author_Institution :
Fujitsu Labs. Ltd., Akashi, Japan
Abstract :
Presents a new architecture of a 2-axis comb-driven micromirror array that combines a large deflection angle in a stationary operation, a low drive voltage, and easy scalability for a 3D MEMS switch. By using an SOI wafer with 100-/spl mu/m thick top and bottom Si layers and a 1-/spl mu/m buried oxide layer and, bulk micromachining with DRIE, we fabricated a 2-axis comb-driven micromirror array with a V-shaped torsion bar and comb teeth. The V-shaped torsion bar that has an optimized spring constant that enables both a large rotational angle and a low drive voltage without creating the undesired pull-in motion of the comb teeth. To implement a 2-axis tilt motion, we fabricated a gold bump for creating a gap under the comb teeth on the electrode substrate and mounted the mirror array substrate onto the electrode substrate by using the flip-chip-transfer technique. We fabricated an 80/spl times/80 switch chip and achieved a +/-5 degree rotation of the 2-axis stationary operation with a 60-V drive voltage.
Keywords :
flip-chip devices; micromachining; micromirrors; microswitches; silicon-on-insulator; sputter etching; 100 micron; 2-axis comb-driven micromirror array; 3D MEMS switches; 60 V; DRIE; SOI wafer; Si; V-shaped torsion bar; bulk micromachining; buried oxide layer; comb teeth; deflection angle; drive voltage; flip-chip-transfer technique; mirror array substrate; optimized spring constant; rotational angle; scalability; Electrodes; Gold; Low voltage; Micromachining; Micromirrors; Microswitches; Scalability; Springs; Switches; Teeth;
Conference_Titel :
Optical MEMs, 2002. Conference Digest. 2002 IEEE/LEOS International Conference on
Conference_Location :
Lugano, Switzerland
Print_ISBN :
0-7803-7595-5
DOI :
10.1109/OMEMS.2002.1031422