Title : 
High frequency (>20 MHz) spherically shaped ceramic transducers
         
        
            Author : 
Lockwood, Geoffrey R. ; Turnbull, Daniel H. ; Foster, F. Stuart
         
        
            Author_Institution : 
Dept. of Med. Biophys., Sunnybrook Health Sci. Centre, Alta.
         
        
        
            fDate : 
31 Oct-3 Nov 1993
         
        
        
            Abstract : 
Difficulty in obtaining well focussed efficient ultrasound transducers has limited the development of new high frequency applications of B-mode imaging. A method of fabricating high frequency spherically shaped lead zirconate titanate (PZT) transducers is described. A transducer is fabricated by bonding a malleable backing layer onto a thin (<100 μm) plate of PZT and then pressing the plate into a spherically shaped well. The backing layer distributes stresses across the material and allows the transducer to be formed without the development of macroscopic cracks. The characteristics of a 2 mm diameter 53 MHz PZT transducer with a 4 mm focal distance are described. This device demonstrated a two-way insertion loss of -25 dB with a 6 dB bandwidth of 30%. A lateral beam width at the focal region of 68 μm was measured. The theoretical diffraction limited beam width is 59 μm. Images of a resolution phantom and normal human skin demonstrate the potential of these transducers in a realistic clinical application
         
        
            Keywords : 
biomedical ultrasonics; ceramics; lead compounds; piezoelectric materials; piezoelectric transducers; ultrasonic transducers; 2 mm; 53 MHz; PZT; PZT transducers; PbZrO3TiO3; ceramic transducers; diffraction limited beam width; fabrication; high frequency; human skin; insertion loss; lateral beam width; phantom; spherical; Bonding; Ceramics; Focusing; Frequency; Insertion loss; Pressing; Stress; Titanium compounds; Ultrasonic imaging; Ultrasonic transducers;
         
        
        
        
            Conference_Titel : 
Ultrasonics Symposium, 1993. Proceedings., IEEE 1993
         
        
            Conference_Location : 
Baltimore, MD
         
        
            Print_ISBN : 
0-7803-2012-3
         
        
        
            DOI : 
10.1109/ULTSYM.1993.339560