Folded U-shaped microwire technology for ultra-compact 3D MMICs

Author

Onodera, K. ; Hirano, M. ; Toyoda, I. ; Tokumitsu, M. ; Tokumitsu, T.

Author_Institution

NTT LSI Labs., Kanagawa, Japan

Volume

2

fYear

1996

fDate

17-21 June 1996

Firstpage

1153

Abstract

A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultracompact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.

Keywords

III-V semiconductors; MMIC; gallium arsenide; integrated circuit interconnections; GaAs; balun; buried wall; coupler; fabrication; folded U-shaped microwire technology; miniature inductor; miniature transmission line; multi-function passive element; multi-level interconnect; polyimide insulator; shielding wall; ultra-compact 3D MMIC; vertical microwire; Couplers; Fabrication; Gallium arsenide; Gold; Insulation; Integrated circuit interconnections; MMICs; Metal-insulator structures; Milling; Polyimides;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1996., IEEE MTT-S International

Conference_Location

San Francisco, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-3246-6

Type

conf

DOI

10.1109/MWSYM.1996.511234

Filename

511234